Measurement of Thermal Expansion Coefficient of Package Material Using Strain Gages
نویسندگان
چکیده
منابع مشابه
Measurement of Thermal Expansion Coefficient Using Strain Gages
w w w. v i s h a y m g . c o m VMR-TC0513-0501 The thermal expansion coefficient is a very basic physical property which can be of considerable importance in mechanical and structural design applications of a material. Although there are many published tabulations of expansion coefficients for the common metals and standard alloys, the need occasionally arises to measure this propertay for a sp...
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The use of strain gages for low temperature thermal expansion measurements is increasing, due to it's convenience, and relative accuracy. The determination of thermal expansion with strain gages is complicated by "thermal output strain", a phenomena caused by the temperature dependence of the gage. If thermal output strain is properly compensated , strain gages may be used to measure thermal ex...
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امروزه لباس در نظر ورزشکاران و کسانی که برای اوقات فراغت خود و یا برای رسیدن به اندامی متعادل، ورزش می کنند؛ بسیار با اهمیت است. احساس مطلوب از لباس در زمره خصوصیات راحتی پوشش می باشد. خصوصیات انتقال رطوبت لباس، در ارزیابی راحتی حسی و حرارتی منسوجات تولید شده از آن ها بسیار مهم است. هدف از این تحقیق، معرفی پارچه جدید است که متشکل از الیاف استبرق با خواص منحصر به فرد می باشد. استبرق لیف طبیعی تو...
Plane-Shear Measurement with Strain Gages
Loading a specimen as shown in Figure 1a produces shear stresses in the material. An initially square element of the material, having vertical sides parallel to the direction of loading, is distorted by these stresses into a diamond shape as illustrated in Figure 1b, where the distortion is greatly exaggerated for pictorial clarity. Shear strain is defined as the magnitude of the change in the ...
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Microlithographic systems rely on precision alignment and a high-level of dimensional stability to achieve required performance. In critical applications, immunity to thermally induced dimensional changes is achieved by the use of low coefficient of thermal expansion (CTE) materials such as ULE® in components such as reflective optics and machine structures. ULE® has an expansion coefficient (α...
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ژورنال
عنوان ژورنال: Journal of the Microelectronics and Packaging Society
سال: 2013
ISSN: 1226-9360
DOI: 10.6117/kmeps.2013.20.3.037